The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 31, 2011

Filed:

Jun. 20, 2007
Applicants:

Kuey-lung Hsueh, Milpitas, CA (US);

Chien-kuo Wang, Hsin-Chu, TW;

Yu-ming Sun, Taoyuan County, TW;

Te-chang Wu, Hsinchu, TW;

Inventors:

Kuey-Lung Hsueh, Milpitas, CA (US);

Chien-Kuo Wang, Hsin-Chu, TW;

Yu-Ming Sun, Taoyuan County, TW;

Te-Chang Wu, Hsinchu, TW;

Assignee:

United Microelectronics Corp., Science-Based Industrial Park, Hsin-Chu, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02H 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A chip includes a core circuit, a main electrostatic discharge immunizing circuit, and a secondary electrostatic discharge immunizing circuit. The secondary electrostatic discharge immunizing circuit is disposed beneath a core power ring formed between the core circuit and the main electrostatic discharge immunizing circuit for reaching the aim of protecting the core circuit from damage by electrostatic discharges without area penalty of the chip. Both the main electrostatic discharge immunizing circuit and the secondary electrostatic discharge immunizing circuit include a power clamp and a plurality of current limiters, and keep electrostatic currents from reaching the core circuit with the aid of the power clamp.


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