The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2011
Filed:
Mar. 16, 2006
Takashi Kitae, Osaka, JP;
Seiichi Nakatani, Osaka, JP;
Seiji Karashima, Osaka, JP;
Yoshihisa Yamashita, Kyoto, JP;
Takashi Ichiryu, Osaka, JP;
Takashi Kitae, Osaka, JP;
Seiichi Nakatani, Osaka, JP;
Seiji Karashima, Osaka, JP;
Yoshihisa Yamashita, Kyoto, JP;
Takashi Ichiryu, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
The invention involves mounting a solder resin composition () including a solder powder () and a resin () on the first electronic component (); arranging such that the connecting terminals () of the first electronic component () and the electrode terminals () of the second electronic component () are facing each other; ejecting a gas () from a gas generation source () included in the first electronic component () by heating the first electronic component () and the solder resin composition; and inducing the flow of the solder powder () in the solder resin composition () by inducing convection of the gas () in the solder resin composition (), and electrically connecting the connecting terminals () and the electrode terminals () by self-assembly on the connecting terminals () and the electrode terminals (). Through this are provided a flip chip packaging method that enables connecting, with high connection reliability, electrode terminals of a semiconductor chip wired with narrow pitch and connecting terminals of a circuit board, and a bump formation method for packaging on a circuit board.