The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2011
Filed:
May. 28, 2009
Applicants:
Kai Liu, Mountain View, CA (US);
Xiaotian Zhang, San Jose, CA (US);
Ming Sun, Sunnyvale, CA (US);
Leeshawn Luo, Santa Clara, CA (US);
Inventors:
Kai Liu, Mountain View, CA (US);
Xiaotian Zhang, San Jose, CA (US);
Ming Sun, Sunnyvale, CA (US);
Leeshawn Luo, Santa Clara, CA (US);
Assignee:
Alpha and Omega Semiconductor Incorporated, Sunnyvale, CA (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A DFN semiconductor package includes a leadframe having a die bonding pad formed integrally with a drain lead, a gate lead and a source lead, a die coupled to the die bonding pad, a die source bonding area coupled to the source lead and a die gate bonding area coupled to the gate lead, and an encapsulant at least partially covering the die, drain lead, gate lead and source lead.