The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2011
Filed:
Jun. 23, 2006
Hyun Hoo Sung, Suwon, KR;
Jong Seob Kim, Daejeon, KR;
Sun Yul Lee, Anyang, KR;
Seung Bae OH, Suwon, KR;
Dae Yun Kim, Yeosu, KR;
Hyun Hoo Sung, Suwon, KR;
Jong Seob Kim, Daejeon, KR;
Sun Yul Lee, Anyang, KR;
Seung Bae Oh, Suwon, KR;
Dae Yun Kim, Yeosu, KR;
Cheil Industries Inc., Gumi-si, KR;
Abstract
A polymer for filling gaps in a semiconductor substrate and a composition using the polymer are provided. According to the composition, holes having a diameter of 100 nm or less and an aspect ratio (i.e. a ratio between the diameter and height of the holes) of 1 or higher in semiconductor substrates can be substantially completely filled by common spin coating without formation of defects, e.g., air voids, the film can be dissolved by an aqueous alkaline solution (i.e. a developing solution) until a desired thickness is reached, the film is highly resistant to isopropyl alcohol (IPA) and plasma etching after curing by baking, and residue can be rapidly removed from the inside of the holes by ashing.