The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7947606 B1

PDF
Full Text
Expired
Date of Patent:
May. 24, 2011

Filed:

May. 29, 2008
Applicants:

Jiang Yan, Newburgh, NY (US);

Roland Hampp, Poughkeepsie, NY (US);

Jin-ping Han, Fishkill, NY (US);

Manfred Eller, Beacon, NY (US);

Alois Gutmann, Poughkeepsie, NY (US);

Inventors:

Jiang Yan, Newburgh, NY (US);

Roland Hampp, Poughkeepsie, NY (US);

Jin-Ping Han, Fishkill, NY (US);

Manfred Eller, Beacon, NY (US);

Alois Gutmann, Poughkeepsie, NY (US);

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
Abstract

Methods of forming features and structures thereof are disclosed. In one embodiment, a method of forming a feature includes forming a first material over a workpiece, forming a first pattern for a lower portion of the feature in the first material, and filling the first pattern with a sacrificial material. A second material is formed over the first material and the sacrificial material, and a second pattern for an upper portion of the feature is formed in the second material. The sacrificial material is removed. The first pattern and the second pattern are filled with a third material.


Find Patent Forward Citations

Yan, Jiang. (2011). Methods of forming conductive features and structures thereof (U.S. Patent No. 7947606). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7947606

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