The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2011
Filed:
Jan. 25, 2008
Applicants:
Fan Zhang, Singapore, SG;
Lup San Leong, Singapore, SG;
Yong Kong Siew, Sungai Pelek, MY;
Bei Chao Zhang, Singapore, SG;
Inventors:
Fan Zhang, Singapore, SG;
Lup San Leong, Singapore, SG;
Yong Kong Siew, Sungai Pelek, MY;
Bei Chao Zhang, Singapore, SG;
Assignee:
Chartered Semiconductor Manufacturing, Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01);
U.S. Cl.
CPC ...
Abstract
The present invention relates to the reduction or complete prevention of Cu corrosion during a planarization or polishing process. In one aspect of the invention, RF signal is used to establish a negative bias in front of the wafer surface following polishing to eliminate Cuor Cumigrations. In another aspect of the invention, a DC Voltage power supply is used to establish the negative bias.