The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2011
Filed:
Jul. 28, 2006
Applicants:
Mike Ravkin, Sunnyvale, CA (US);
John Boyd, Atascadero, CA (US);
Yezdi N. Dordi, Palo Alto, CA (US);
Fred C. Redeker, Fremont, CA (US);
John M. DE Larios, Palo Alto, CA (US);
Inventors:
Mike Ravkin, Sunnyvale, CA (US);
John Boyd, Atascadero, CA (US);
Yezdi N. Dordi, Palo Alto, CA (US);
Fred C. Redeker, Fremont, CA (US);
John M. de Larios, Palo Alto, CA (US);
Assignee:
Lam Research Corporation, Fremont, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/06 (2006.01); C25D 5/04 (2006.01); C25D 17/14 (2006.01); C25D 17/12 (2006.01); C25D 7/12 (2006.01);
U.S. Cl.
CPC ...
Abstract
An electroplating apparatus for depositing a metallic layer on a surface of a wafer is provided. In one example, a proximity head capable of being electrically charged as an anode is placed in close proximity to the surface of the wafer. A plating fluid is provided between the wafer and the proximity head to create localized metallic plating.