The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2011
Filed:
Oct. 10, 2007
Hiroyuki Kanda, Tokyo, JP;
Akira Susaki, Tokyo, JP;
Satoru Yamamoto, Tokyo, JP;
Tsutomu Nakada, Tokyo, JP;
Hiroyuki Kanda, Tokyo, JP;
Akira Susaki, Tokyo, JP;
Satoru Yamamoto, Tokyo, JP;
Tsutomu Nakada, Tokyo, JP;
Ebara Corporation, Tokyo, JP;
Abstract
A substrate processing apparatus can carry out removal of a passive layer (ruthenium oxide) present on a surface of a ruthenium film and electroplating successively, and can reduce the terminal effect at the time of the removal of the passive layer (ruthenium oxide) from the ruthenium film. The substrate processing apparatus includes: an electrolytic processing apparatus for electrochemically removing a passive layer, formed on a surface of a ruthenium film on a substrate, by electrolytic processing with the ruthenium film as a cathode; a copper electroplating apparatus for carrying out copper electroplating on the surface of the ruthenium film on the substrate; and an apparatus frame housing the electrolytic processing apparatus and the copper electroplating apparatus.