The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2011
Filed:
Aug. 09, 2007
Natsuyo Morioka, Tokyo, JP;
Seiji Ishikawa, Kawasaki, JP;
Katsumi Ikegaya, Akishima, JP;
Yasunori Yamaguchi, Fussa, JP;
Kazuo Ito, Oume, JP;
Yuichi Hamamura, Yokohama, JP;
Natsuyo Morioka, Tokyo, JP;
Seiji Ishikawa, Kawasaki, JP;
Katsumi Ikegaya, Akishima, JP;
Yasunori Yamaguchi, Fussa, JP;
Kazuo Ito, Oume, JP;
Yuichi Hamamura, Yokohama, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
An average fault ratio is calculated from product characteristics of a product as a target of yield prediction, in order to predict yield accurately in the course of manufacturing the prediction target product. With respect to a reference product, whose wiring pattern is different from the prediction target product but manufactured by the same manufacturing process, a monthly electric fault density is calculated from actually measured data. Respective average fault ratios are obtained from product characteristics of the prediction target product and the reference product. A monthly electric fault density of the prediction target product is obtained by multiplying the monthly electric fault density of the reference product by the ratio of the average fault ratios. The yield is calculated by using the monthly electric fault density of the month in which a yield prediction target lot of the prediction target product was processed.