The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2011
Filed:
Mar. 04, 2009
Seiya Fujii, Chuo-ku, JP;
Seiya Fujii, Chuo-ku, JP;
Elpida Memory, Inc., Tokyo, JP;
Abstract
A semiconductor device comprises a package substrate, a semiconductor chip, a plurality of bump electrodes and one or more dummy chips. The semiconductor chip is mounted on one surface of the package substrate. The bump electrodes are the other surface of the package substrate and electrically connected to the semiconductor chip through a wiring structure. Each of the dummy chips is mounted on a predetermined region close to a corner portion of the semiconductor chip on the one surface of the package substrate. In the semiconductor chip, the dummy chips are formed of material having the same or similar coefficient of thermal expansion as that of the semiconductor chip. Therefore the stress caused by a difference between coefficients of thermal expansion is suppressed so as to improve connection reliability.