The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2011
Filed:
Jun. 18, 2004
Howard E. Rhodes, Boise, ID (US);
Steven D. Cummings, Boise, ID (US);
Howard E. Rhodes, Boise, ID (US);
Steven D. Cummings, Boise, ID (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
A four layer interconnect structure is disclosed which includes a bottom conductive reactive layer such as titanium, a conductive barrier layer, such as titanium nitride, a conductive layer, such as aluminum-copper alloy, and a top conductive barrier layer, such as titanium nitride. The interconnection structure can be fabricated using conventional sputter deposition technology. The resulting interconnection structure provides a highly conductive thin film structure that provides good contact to tungsten plugs with small contact dimensions, good patternability on fine lines, and good reliability.