The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2011
Filed:
Jan. 04, 2007
Takashi Nakagawa, Kawasaki, JP;
Seiichi Sugano, Kawasaki, JP;
Kenji Iida, Kawasaki, JP;
Yasutomo Maehara, Kawasaki, JP;
Hitoshi Suzuki, Kawasaki, JP;
Kaoru Sugimoto, Kawasaki, JP;
Kenji Fukuzono, Kawasaki, JP;
Takashi Kanda, Kawasaki, JP;
Hiroaki Date, Kawasaki, JP;
Tomohisa Yagi, Kawasaki, JP;
Takashi Nakagawa, Kawasaki, JP;
Seiichi Sugano, Kawasaki, JP;
Kenji Iida, Kawasaki, JP;
Yasutomo Maehara, Kawasaki, JP;
Hitoshi Suzuki, Kawasaki, JP;
Kaoru Sugimoto, Kawasaki, JP;
Kenji Fukuzono, Kawasaki, JP;
Takashi Kanda, Kawasaki, JP;
Hiroaki Date, Kawasaki, JP;
Tomohisa Yagi, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A process for producing a multilayer board includes the steps of applying a bonding ink to the terminal of the first substrate, the bonding ink including a thermosetting resin containing a filler and a curing agent, the filler being formed of metal particles plated with solder, the metal particles each having a first melting point, and the solder having a second melting point lower than the first melting point; bonding the second substrate to a bonding sheet composed of a thermosetting resin and having a through hole disposed in a portion corresponding to the terminal of the second substrate; and heating and pressurizing the first and second substrates with the bonding sheet in such a manner that the terminals are opposite each other to effect curing of the bonding sheet and the bonding ink and to form an integral structure.