The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2011

Filed:

Aug. 22, 2008
Applicants:

Edward Yi Chang, Hsinchu, TW;

Wei-cheng Wu, Hsinchu, TW;

Ruey-bing Hwang, Hsinchu, TW;

Li-han Hsu, Hsinchu, TW;

Inventors:

Edward Yi Chang, Hsinchu, TW;

Wei-Cheng Wu, Hsinchu, TW;

Ruey-Bing Hwang, Hsinchu, TW;

Li-Han Hsu, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 5/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A vertical transmission structure for high frequency transmission lines includes a conductive axial core and a conductive structure surrounding the conductive axial core. The vertical transmission structure is applied to a high-frequency flip chip package for reducing the possibility of underfill from coming in contact with the conductive axial core.


Find Patent Forward Citations

Quick Actions:

Chang, Edward. (2011). Vertical transmission line structure that includes bump elements for flip-chip mounting (U.S. Patent No. 7940143). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7940143

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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