The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2011

Filed:

Aug. 28, 2009
Applicant:

Sheng-tsung Liu, Kaohsiung, TW;

Inventor:

Sheng-Tsung Liu, Kaohsiung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/495 (2006.01); H01L 29/78 (2006.01); H01L 29/739 (2006.01);
U.S. Cl.
CPC ...
Abstract

A leadframe including a chip supporting plate, a lead forming plate, and solder points is provided. A notch is formed on an edge of the chip supporting plate. The thickness of the lead forming plate is less than the thickness of the chip supporting plate. The lead forming plate has a main body, inner leads, and a connecting rod. The inner leads and the connecting rod are extended from an edge of the main body. The connecting rod has an end portion fitting the notch. The solder points are located at the boundary between the end portion and the notch for structurally connecting the connecting rod and the chip supporting plate.


Find Patent Forward Citations

Liu, Sheng-Tsung. (2011). Leadframe (U.S. Patent No. 7939921). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7939921

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…