The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2011
Filed:
Oct. 14, 2008
Yutaka Kagaya, Tokyo, JP;
Hidehiro Takeshima, Tokyo, JP;
Yutaka Kagaya, Tokyo, JP;
Hidehiro Takeshima, Tokyo, JP;
Elpida Memory, Inc., Chuo-ku, Tokyo, JP;
Abstract
Semiconductor deviceincludes wiring substrateincluding wiringand wiringin predetermined patterns, semiconductor chipsandwhich are mounted on wiring substratewith electrodes electrically connected to wiringof wiring substratevia wiresand, first sealing bodymade of an insulative resin which is formed on a part of wiring substrateand which covers semiconductor chipsandand wiresand, a plurality of connecting connection padsprovided on the top surface of first sealing body, a plurality of connecting wireswhich extend from the surface of wiring substrate, on which semiconductor chipsandare mounted, to the top surface of first sealing bodyvia the side surfaces of first sealing body, and which electrically connect wiringof wiring substrateand the plurality of connecting connection padsand second sealing bodymade of an insulative resin which covers the plurality of connecting wires