The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2011
Filed:
Apr. 04, 2008
Toshiya Kotani, Tokyo, JP;
Yasunobu Kai, Yokohama, JP;
Soichi Inoue, Yokohama, JP;
Satoshi Tanaka, Kawasaki, JP;
Shigeki Nojima, Yokohama, JP;
Kazuyuki Masukawa, Yokohama, JP;
Koji Hashimoto, Yokohama, JP;
Toshiya Kotani, Tokyo, JP;
Yasunobu Kai, Yokohama, JP;
Soichi Inoue, Yokohama, JP;
Satoshi Tanaka, Kawasaki, JP;
Shigeki Nojima, Yokohama, JP;
Kazuyuki Masukawa, Yokohama, JP;
Koji Hashimoto, Yokohama, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
A parameter adjustment method for a plurality of manufacturing devices to form a pattern of a semiconductor device on a substrate using the manufacturing devices includes: adjusting a parameter adjustable for a manufacturing device serving as a reference manufacturing device; obtaining a first shape of a pattern of a semiconductor device to be formed on a substrate; defining an adjustable parameter of another to-be-adjusted manufacturing; obtaining a second shape of the pattern formed on the substrate; calculating a difference amount between a reference finished shape and a to-be-adjusted finished shape; repeatedly calculating the difference amount by changing the to-be-adjusted parameter until the difference amount becomes equal to or less than a predetermined reference value; and outputting as a parameter of the to-be-adjusted manufacturing device the to-be-adjusted parameter.