The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2011
Filed:
Dec. 02, 2005
Applicants:
Toshio Kudo, Tokyo, JP;
Bunji Mizuno, Ikoma, JP;
Yuichiro Sasaki, Machida, JP;
Cheng-guo Jin, Kanagawa, JP;
Inventors:
Toshio Kudo, Tokyo, JP;
Bunji Mizuno, Ikoma, JP;
Yuichiro Sasaki, Machida, JP;
Cheng-Guo Jin, Kanagawa, JP;
Assignees:
Sumitomo Heavy Industries, Ltd., Tokyo, JP;
Panasonic Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/31 (2006.01); H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A laser annealing process capable of suppressing a variation in sheet resistance. A surface layer formed shallower than 100 nm in a substrate of semiconductor material is added with impurities. The substrate is irradiated with a laser beam or its harmonic beam emitted from a laser diode pumped to solid-state laser to activate the impurities.