The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2011
Filed:
Feb. 12, 2008
Jong-heun Lim, Seoul, KR;
Chang-ki Hong, Gyeonggi-do, KR;
Bo-un Yoon, Seoul, KR;
Dae-lok Bae, Seoul, KR;
Seong-kyu Yun, Seoul, KR;
Suk-hun Choi, Byeonggi-do, KR;
Jong-Heun Lim, Seoul, KR;
Chang-Ki Hong, Gyeonggi-do, KR;
Bo-Un Yoon, Seoul, KR;
Dae-Lok Bae, Seoul, KR;
Seong-Kyu Yun, Seoul, KR;
Suk-Hun Choi, Byeonggi-do, KR;
Abstract
Spaced apart bonding surfaces are formed on a first substrate. A second substrate is bonded to the bonding surfaces of the first substrate and cleaved to leave respective semiconductor regions from the second substrate on respective ones of the spaced apart bonding surfaces of the first substrate. The bonding surfaces may include surfaces of at least one insulating region on the first substrate, and at least one active device may be formed in and/or on at least one of the semiconductor regions. A device isolation region may be formed adjacent the at least one of the semiconductor regions.