The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2011
Filed:
Nov. 03, 2005
Robert M. Japp, Vestal, NY (US);
Voya R. Markovich, Endwell, NY (US);
Kostas I. Papathomas, Endicott, NY (US);
Robert M. Japp, Vestal, NY (US);
Voya R. Markovich, Endwell, NY (US);
Kostas I. Papathomas, Endicott, NY (US);
Endicott Interconnect Technologies, Inc., Endicott, NY (US);
Abstract
A dielectric composition which is adapted for combining with a supporting material ( e.g., fiber-glass cloth) to form a dielectric layer usable in circuitized such as PCBs, chip carriers and the like. As such a layer, it includes a resin, a predetermined percentage by weight of a filler, and, significantly, only a minor amount of bromine. A circuitized substrate comprised of one or more of these dielectric layers and one or more conductive layers is also provided.