The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2011
Filed:
Mar. 07, 2006
Koichi Hirano, Osaka, JP;
Seiji Karashima, Osaka, JP;
Takashi Ichiryu, Osaka, JP;
Yoshihiro Tomita, Osaka, JP;
Seiichi Nakatani, Osaka, JP;
Koichi Hirano, Osaka, JP;
Seiji Karashima, Osaka, JP;
Takashi Ichiryu, Osaka, JP;
Yoshihiro Tomita, Osaka, JP;
Seiichi Nakatani, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
To provide a flip-chip mounting method and a bump formation method applicable to flip-chip mounting of a next generation LSI and having high productivity and high reliability. A semiconductor chiphaving a plurality of electrode terminalsis held to oppose a circuit boardhaving a plurality of connection terminalswith a given gap provided therebetween, and the semiconductor chipand the circuit boardin this state are dipped in a dipping bathcontaining a melted resinincluding melted solder particles for a given period of time. In this dipping process, the melted solder particles self-assemble between the connection terminalsof the circuit boardand the electrode terminalsof the semiconductor chip, so as to form connectorsbetween these terminals. Thereafter, the semiconductor chipand the circuit boardare taken out of the dipping bath, and the melted resinhaving permeated into the gap between the semiconductor chipand the circuit boardis cured, so as to complete a flip-chip mounting body.