The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2011
Filed:
Feb. 07, 2005
Xiang Chen, Singapore, SG;
Shu Chuen Ho, Singapore, SG;
Teng Hock Eric Kuah, Singapore, SG;
SI Liang LU, Singapore, SG;
See Yap Ong, Singapore, SG;
Xiang Chen, Singapore, SG;
Shu Chuen Ho, Singapore, SG;
Teng Hock Eric Kuah, Singapore, SG;
Si Liang Lu, Singapore, SG;
See Yap Ong, Singapore, SG;
ASM Technology Singapore Pte Ltd, Singapore, SG;
Abstract
An apparatus and process are provided for molding electronic devices in a mold, which apparatus comprises at least one runner in the mold connected to a mold supply pot for channeling a molding compound from the mold supply pot to the electronic devices. A plunger assembly is also provided that comprises a main body, and a supplementary body configured to be movable relative to the main body. The plunger assembly is locatable in the mold supply pot and is drivable in a direction towards the runner for forcing the molding compound into the runner. In order to avoid or reduce cull formation, a width of the runner at an opening connecting the runner to the mold supply pot is smaller than a width of the main body of the plunger assembly.