The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2011
Filed:
Jun. 03, 2004
Masanori Nakai, Hyogo, JP;
Masaaki Yamanaka, Hyogo, JP;
Yoshizumi Ishitobi, Hyogo, JP;
A.L.M.T. Corp., Tokyo, JP;
Abstract
A superabrasive wire saw-wound structure includes a superabrasive wire saw () formed with an average diameter D and a reel (). The superabrasive wire saw () includes a core wire (), a bonding material () surrounding a surface of the core wire (), and a plurality of superabrasive grains () bonded to the surface of the core wire () with the bonding material (). The reel () includes a peripheral surface () having one end () and the other end (). The superabrasive wire saw () which is to be unreeled successively toward a workpiece is wound around the peripheral surface () reciprocatingly between the one end () and the other end () to be multi-layered. A pitch P for winding the superabrasive wire saw () around the peripheral surface () between the one end () and the other end () satisfies a relation of D<P<2D. According to the present invention, there can be provided a superabrasive wire saw-wound structure, a cutting device with a superabrasive wire saw, and a method of winding a superabrasive wire saw which can reduce damage to a bonding material and falling of a superabrasive grain.