The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2011
Filed:
Mar. 08, 2007
Chien-huei (Adam) Chen, San Jose, CA (US);
Ajay Gupta, San Jose, CA (US);
Richard Wallingford, San Jose, CA (US);
Kaustubh (Kaust) Namjoshi, Sunnyvale, CA (US);
Mike Van Riet, Morgan Hill, CA (US);
Michael Cook, Windsor Berkshire, GB;
Chien-Huei (Adam) Chen, San Jose, CA (US);
Ajay Gupta, San Jose, CA (US);
Richard Wallingford, San Jose, CA (US);
Kaustubh (Kaust) Namjoshi, Sunnyvale, CA (US);
Mike Van Riet, Morgan Hill, CA (US);
Michael Cook, Windsor Berkshire, GB;
KLA-Tencor Technologies Corp., Milpitas, CA (US);
Abstract
Methods for identifying array areas in dies formed on a wafer and methods for setting up such methods are provided. One method for identifying array areas in dies formed on a wafer includes comparing an array pattern in a template image acquired in one of the array areas to a search area image acquired for the wafer. The method also includes determining areas in the search area image in which a pattern is formed that substantially matches the array pattern in the template image based on results of the comparing step. In addition, the method includes identifying the array areas in the dies formed on the wafer based on results of the determining step.