The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2011
Filed:
Oct. 29, 2004
Applicants:
Mark Huth, Corvallis, OR (US);
Philip G Rourke, Corvallis, OR (US);
Craig M. Gates, Corvallis, OR (US);
Inventors:
Mark Huth, Corvallis, OR (US);
Philip G Rourke, Corvallis, OR (US);
Craig M. Gates, Corvallis, OR (US);
Assignee:
Hewlett-Packard Development Company, L.P., Houston, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of laser machining a substrate is provided. The method comprises directing laser energy at a first surface of the substrate, while providing an assist medium at the first surface of the substrate at least at approximately the area at which the laser energy is being directed. The assist medium is no longer provided prior to completion of formation of a feature in the substrate created utilizing the laser energy.