The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2011
Filed:
Jan. 27, 2006
Toshio Haba, Naka, JP;
Hiroshi Yoshida, Mito, JP;
Haruo Akahoshi, Hitachi, JP;
Hitoshi Suzuki, Hitachi, JP;
Toshio Haba, Naka, JP;
Hiroshi Yoshida, Mito, JP;
Haruo Akahoshi, Hitachi, JP;
Hitoshi Suzuki, Hitachi, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
The present invention provides a method for producing a metal structure comprising a substrate and a metal film formed on the substrate; comprising the steps of providing surface having irregularities made of a electrical conductor in the area of the substrate where the metal body or film is to be formed; and preferentially forming the metal body or film by electroplating in the area provided with the conductive surface having irregularities. The plating bath may preferably contain an additive compound such as a cyanine dye which is capable of suppressing the plating reaction, and which loses such plating-suppressing effect with the progress of the plating reaction. The metal film can be produced by electroplating in the area provided with the surface having irregularities.