The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 12, 2011

Filed:

Dec. 16, 2009
Applicants:

Chalermsak Sumithpibul, Samutprakarn, TH;

Somchai Nondhasitthichai, Bangkok, TH;

Apichart Phaowongsa, Prakarn, TH;

Inventors:

Chalermsak Sumithpibul, Samutprakarn, TH;

Somchai Nondhasitthichai, Bangkok, TH;

Apichart Phaowongsa, Prakarn, TH;

Assignee:

Utac Thai Limited, Bangna Bangkok, TH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 17/16 (2006.01); C25D 17/22 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of plating a plurality of semiconductor devices includes: applying an electrical power source to an anode terminal and a cathode terminal; placing the plurality of semiconductor devices on a non-conductive platform in a plating solution; moving conductive parts across surfaces of the semiconductor devices to be plated, wherein the conductive parts electrically connect the surfaces of the semiconductor devices to the cathode; and wherein plating particles connected to the anode terminal move to and plate the surfaces of the semiconductor devices.


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