The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 12, 2011

Filed:

Sep. 21, 2006
Applicants:

AL Nolette, Biddeford, ME (US);

Paul Carter, Waterboro, ME (US);

Dean Plaisted, Kennebunk, ME (US);

Alan Plaisted, Swanton, VT (US);

Inventors:

Al Nolette, Biddeford, ME (US);

Paul Carter, Waterboro, ME (US);

Dean Plaisted, Kennebunk, ME (US);

Alan Plaisted, Swanton, VT (US);

Assignee:

Soleras, LTd., Biddeford, ME (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); B23K 31/02 (2006.01); C23C 14/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The process that is the subject of this invention is a method of making a rotary sputtering target having the steps of providing a cylinder of sputtering target material having an adhesion-wetting layer on its inside surface; providing a stainless steel sputtering target backing tube having an outside diameter smaller than the sputtering target material inside diameter, the backing tube having an adhesion-wetting layer on its outside surface; welding an upper and lower stainless steel retaining ring to the backing tube adjacent to the sputtering target material so that the target material is in compression and the backing tube in tension; and introducing molten bonding material into the annulus between the backing tube and the sputtering target material. The apparatus that is the subject of the present invention is a rotary sputtering target apparatus having a cylinder of sputtering target material; a backing tube having a smaller outside diameter than the inside diameter of the sputtering target material; and bonding material disposed between the target material and backing tube, the bonding material bonding them together.


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