The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2011
Filed:
Apr. 04, 2007
Applicants:
Hiroaki Kodama, Ibi-gun, JP;
Kazuhito Yamada, Ibi-gun, JP;
Inventors:
Hiroaki Kodama, Ibi-gun, JP;
Kazuhito Yamada, Ibi-gun, JP;
Assignee:
Ibiden Co., Ltd., Ogaki-shi, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/04 (2006.01); H01L 29/22 (2006.01);
U.S. Cl.
CPC ...
Abstract
A package substrate includes a laminated body having a conductor circuit and an insulating layer formed and laminated, solder resist layers formed and laminated on both sides of the laminated body, respectively, an optical element, and an optical path for transmitting an optical signal. One or more of the solder resist layers formed and laminated on the laminated body is an outermost layer which has a transmittance for light having a wavelength for communication of about 60% or more at a thickness of 30 μm.