The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2011
Filed:
Aug. 15, 2008
Hansong Cheng, Allentown, PA (US);
Xinjian Lei, Vista, CA (US);
Daniel P. Spence, San Diego, CA (US);
John Anthony Thomas Norman, Encinitas, CA (US);
David Allen Roberts, Fogelsville, PA (US);
BO Han, Wuhan, CN;
Chenggang Zhou, Wuhan, CN;
Jinping Wu, Wuhan, CN;
Hansong Cheng, Allentown, PA (US);
Xinjian Lei, Vista, CA (US);
Daniel P. Spence, San Diego, CA (US);
John Anthony Thomas Norman, Encinitas, CA (US);
David Allen Roberts, Fogelsville, PA (US);
Bo Han, Wuhan, CN;
Chenggang Zhou, Wuhan, CN;
Jinping Wu, Wuhan, CN;
Air Products and Chemicals, Inc., Allentown, PA (US);
Abstract
We have used the state-of-the-art computational chemistry techniques to identify adhesion promoting layer materials that provide good adhesion of copper seed layer to the adhesion promoting layer and the adhesion promoting layer to the barrier layer. We have identified factors responsible for providing good adhesion of copper layer on various metallic surfaces and circumstances under which agglomeration of copper film occur. Several promising adhesion promoting layer materials based on chromium alloys have been predicted to be able to significantly enhance the adhesion of copper films. Chromium containing complexes of a polydentate β-ketoiminate have been identified as chromium containing precursors to make the alloys with chromium.