The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2011
Filed:
Aug. 22, 2007
Yuichi Morita, Yokosuka, JP;
Takashi Noma, Ota, JP;
Yuichi Morita, Yokosuka, JP;
Takashi Noma, Ota, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Sanyo Semiconductor Co., Ltd., Gunma, JP;
Abstract
This invention is directed to offer a technology that makes it possible to form desired bump electrodes easily when the bump electrodes are to be formed at locations lowered by a step. There is formed an isolation layerto isolate each of bump electrode forming regions. The isolation layeris a resist layer, for example, and is formed by exposure and development processes, for example. Each of the bump electrode forming regionsis surrounded by the isolation layerand a protection layerthat covers a side surface of a semiconductor substrate. Then, a printing maskthat has openingsat locations corresponding to the bump electrode forming regionsis placed above the semiconductor substrate. Next, solderin paste form is applied to the printing mask. Then the solderis applied to a metal layerby moving a squeezeat a constant speed. Bump electrodesare obtained by heating, melting and re-crystallizing the solderafter removing the printing mask