The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2011
Filed:
Mar. 30, 2007
Masaru Kurihara, Kawasaki, JP;
Masaru Izawa, Hino, JP;
Junichi Tanaka, Hachioji, JP;
Hitachi, Ltd., Tokyo, JP;
Renesas Electronics Corporation, Kanagawa, JP;
Abstract
The present invention provides a manufacturing technique of a semiconductor device that reduces fluctuation of electric characteristic and a working size of a semiconductor device and can manufacture semiconductor devices at high quality and at high yield. In a semiconductor device manufacturing system, a control method for a manufacturing process of a semiconductor device having a function (a data collecting unit) of collecting examination data at a plurality of examining steps including an examining step of setting a length of a measurement region in a wiring direction to at least 10 times a wire width to measure the wire width and an examining step of examining the wire width, a function (a data analyzing unit) of generating a prediction model of electric characteristic or working size of a semiconductor device using the examination data to generate a control model from the prediction model, and a function (a process control unit) of properly controlling processing conditions for a control process based upon examination data of the plurality of examining steps in the manufacturing process of a semiconductor device and the control model is realized.