The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2011
Filed:
Oct. 04, 2007
Nicholas C. Fuller, North Hills, NY (US);
Michael A. Guillorn, Yorktown Heights, NY (US);
Balasubramanian S. Pranatharthi Haran, Watervliet, NY (US);
Jyotica V. Patel, Port Chester, NY (US);
Nicholas C. Fuller, North Hills, NY (US);
Michael A. Guillorn, Yorktown Heights, NY (US);
Balasubramanian S. Pranatharthi Haran, Watervliet, NY (US);
Jyotica V. Patel, Port Chester, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An inorganic electron beam sensitive oxide layer is formed on a carbon based material layer or an underlying layer. The inorganic electron beam sensitive oxide layer is exposed with an electron beam and developed to form patterned oxide regions. An ultraviolet sensitive photoresist layer is applied over the patterned oxide regions and exposed surfaces of the carbon based material layer, and subsequently exposed with an ultraviolet radiation and developed. The combined pattern of the patterned ultraviolet sensitive photoresist and the patterned oxide regions is transferred into the carbon based material layer, and subsequently into the underlying layer to form trenches. The carbon based material layer serves as a robust mask for performing additional pattern transfer into the underlying layer, and may be easily stripped afterwards. The patterned ultraviolet sensitive photoresist, the patterned oxide regions, and the patterned carbon based material layer are subsequently removed.