The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2011
Filed:
Aug. 14, 2008
Ryoji Matsushima, Yokkaichi, JP;
Naohisa Okumura, Yokohama, JP;
Ryoji Matsushima, Yokkaichi, JP;
Naohisa Okumura, Yokohama, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
A semiconductor element is provided with electrode pads which are arranged on a front surface of an element main body, an insulating protection film which covers the front surface of the element main body excepting its outer peripheral area while exposing the electrode pads, and an insulating adhesive layer which is formed to cover a back surface, a sidewall surface and a corner between the front surface and the sidewall surface of the element main body. A plurality of semiconductor elements are stacked on a circuit substrate. The semiconductor elements are adhered via the insulating adhesive layer.