The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2011

Filed:

Dec. 07, 2007
Applicants:

Yuya Yoshino, Nagano, JP;

Akinobu Inoue, Nagano, JP;

Atsunori Kajiki, Nagano, JP;

Sadakazu Akaike, Nagano, JP;

Norio Yamanishi, Nagano, JP;

Takashi Tsubota, Nagano, JP;

Inventors:

Yuya Yoshino, Nagano, JP;

Akinobu Inoue, Nagano, JP;

Atsunori Kajiki, Nagano, JP;

Sadakazu Akaike, Nagano, JP;

Norio Yamanishi, Nagano, JP;

Takashi Tsubota, Nagano, JP;

Assignee:

Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A package includes: a package body including a substrate, an electronic component mounted on a first surface of the substrate, and a sealing resin layer for sealing the electronic component; and a shield case for covering the sealing resin layer, the shield case being made of metal and having an inverted U-shape in a cross-sectional view, wherein a bent part of the shield case is formed in such a manner that at least a part of an end of the shield case is bent toward a second surface of the substrate opposite to the first surface, and the bent part abuts on the second surface so that the shield case is attached to the substrate.


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