The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2011
Filed:
Sep. 05, 2008
Klaus Pressel, Regensburg, DE;
Gottfried Beer, Nittendorf, DE;
Klaus Pressel, Regensburg, DE;
Gottfried Beer, Nittendorf, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A method of manufacturing a stacked die module includes applying a plurality of stacked die structures to a carrier. Each stacked die structure includes a first semiconductor die applied to the carrier and a second semiconductor die stacked over the first semiconductor die. The second semiconductor die has a larger lateral surface area than the first semiconductor die. A dam is applied around each of the stacked die structures, thereby forming an enclosed cavity for each of the stacked die structures. The enclosed cavity for each stacked die structure surrounds the first semiconductor die of the stacked die structure.