The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2011
Filed:
Mar. 13, 2008
Lan H. Hoang, San Jose, CA (US);
Raghunandan Chaware, Sunnyvale, CA (US);
Laurene Yip, San Francisco, CA (US);
Lan H. Hoang, San Jose, CA (US);
Raghunandan Chaware, Sunnyvale, CA (US);
Laurene Yip, San Francisco, CA (US);
Xilinx, Inc., San Jose, CA (US);
Abstract
A molded integrated circuit package is described. The molded integrated circuit package comprises a substrate having a plurality of contacts on a first surface; a die having a plurality of solder bumps on a first surface, the plurality of solder bumps being coupled to the plurality of contacts on the first surface of the substrate; an adhesive material positioned on a second surface of the die; a lid attached to the adhesive material; and an encapsulant positioned between the lid and the substrate. Methods of forming molded integrated circuit packages are also disclosed.