The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2011
Filed:
Sep. 06, 2007
Low Peng Wang, Singapore, SG;
Low Peng Wang, Singapore, SG;
Micron Technology, Inc., Boise, ID (US);
Abstract
A die module and method for assembling such a die module is provided. For example, present embodiments include providing a substrate and coupling a first sub-stack to the substrate, wherein the first sub-stack includes two or more die arranged in a first shingle stack configuration relative to one another such that an upper portion of each die in the first sub-stack is accessible, the first shingle stack configuration having a first skew. Further, present embodiments include stacking a second sub-stack on top of the first sub-stack, wherein the second sub-stack includes two or more die arranged in a second shingle stack configuration relative to one another such that an upper portion of each die in the second sub-stack is accessible, the second shingle stack configuration having a second skew that is different than the first skew.