The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2011
Filed:
Feb. 22, 2007
Yasushi Taniguchi, Osaka, JP;
Seiichi Nakatani, Osaka, JP;
Seiji Karashima, Osaka, JP;
Takashi Kitae, Osaka, JP;
Susumu Matsuoka, Osaka, JP;
Masayoshi Koyama, Osaka, JP;
Yasushi Taniguchi, Osaka, JP;
Seiichi Nakatani, Osaka, JP;
Seiji Karashima, Osaka, JP;
Takashi Kitae, Osaka, JP;
Susumu Matsuoka, Osaka, JP;
Masayoshi Koyama, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
In a method for forming bumpson electrodesof a wiring board, a fluidcontaining conductive particlesand a gas bubble generating agent is supplied onto a first regionincluding the electrodeson the wiring board. Then, a substratewhich has a protruding surfacehaving the same area as that of the first regionand formed on a main surfaceof the substratehaving a larger area than that of the first regionis disposed so that the protruding surfacefaces the first regionof the wiring board. Then, the fluidis heated to generate gas bubblesfrom the gas bubble generating agent contained in the fluid