The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2011
Filed:
Aug. 27, 2007
Hao LI, Shenzhen, CN;
Jun Long, Shenzhen, CN;
Tao LI, Shenzhen, CN;
Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Shenzhen, Guangdong Province, CN;
Foxconn Technology Co., Ltd., Tucheng, Taipei County, TW;
Abstract
A heat dissipation device for dissipating heat from an electronic component () mounted on a printed circuit board () includes a retention module () resting on the printed circuit board, a heat sink () disposed on the retention module for contacting the electronic component, a clip () for securing the heat sink to the retention module, and a back plate unit mounted below the printed circuit board for engaging with the retention module and supporting the electronic component. The back plate unit includes a back plate (), a gasket () engaging with the back plate, and a bracket () being sandwiched between the gasket and the back plate. The gasket has an annular top face contacting the printed circuit board, and a plurality of blocks () contacting the back plate, whereby the gasket can provide a sufficient and uniform support to the electronic component.