The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2011
Filed:
Apr. 28, 2008
Masafumi Horio, Matsumoto, JP;
Tatsuo Nishizawa, Matsumoto, JP;
Eiji Mochizuki, Matsumoto, JP;
Rikihiro Maruyama, Matsumoto, JP;
Masafumi Horio, Matsumoto, JP;
Tatsuo Nishizawa, Matsumoto, JP;
Eiji Mochizuki, Matsumoto, JP;
Rikihiro Maruyama, Matsumoto, JP;
Fuji Electric Systems Co., Ltd., Tokyo, JP;
Abstract
A semiconductor module includes a first metal foil; an insulating sheet mounted on a top surface of the first metal foil; at least one second metal foil mounted on a top surface of the insulating sheet; at least one semiconductor device mounted on the second metal foil; and a resin case for surrounding the first metal foil, insulating sheet, second metal foil, and semiconductor device. A bottom end of a peripheral wall of the resin case is located above a bottom surface of the first metal foil. A resin is provided inside the resin case to fill the inside of the resin case. The bottom surface of the first metal foil and the resin form a flat bottom surface so that the flat bottom surface contacts an external mounting member.