The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2011
Filed:
Dec. 27, 2006
Takaki Kuno, Kyoto, JP;
Yoshinori Noguchi, Kyoto, JP;
Keiji Maeda, Kyoto, JP;
Satoshi Kitaoka, Nagoya, JP;
Naoki Kawashima, Nagoya, JP;
Takaki Kuno, Kyoto, JP;
Yoshinori Noguchi, Kyoto, JP;
Keiji Maeda, Kyoto, JP;
Satoshi Kitaoka, Nagoya, JP;
Naoki Kawashima, Nagoya, JP;
Towa Corporation, Kyoto-shi, JP;
Japan Fine Ceramics Center, Nagoya-shi, JP;
Abstract
An upper die has a cavity member constituting an inner bottom surface of a cavity, and a surrounding member. The cavity member is formed of a low adhesion material in accordance with the present invention, and includes a body portion and a surface layer formed on an undersurface of the body portion exposed to a fluid resin. The body portion is formed of a first material of 3YSZ and a second material of ZrN that are mixed at a predetermined ratio. The surface layer is formed of YOhaving a low adhesion property with respect to a set resin, and has a thermal expansion coefficient smaller than that of the body portion. By bonding the body portion and the surface layer at a high temperature and then cooling them down, compressive residual stress is caused in the surface layer due to a difference in the thermal expansion coefficients thereof, and the compressive residual stress is present in the surface layer.