The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2011
Filed:
Mar. 03, 2008
Srikanth Narasimalu, Singapore, SG;
Sathish Kumar Balakrishnan, Singapore, SG;
Ning Ying, Singapore, SG;
Shu Chuen Ho, Singapore, SG;
Srikanth Narasimalu, Singapore, SG;
Sathish Kumar Balakrishnan, Singapore, SG;
Ning Ying, Singapore, SG;
Shu Chuen Ho, Singapore, SG;
ASM Technology Singapore Pte Ltd, Singapore, SG;
Abstract
A molding apparatus comprises first and second mold chases that are configured to clamp an electronic device therebetween, and a driving mechanism which drives the first and second mold chases to apply a clamping force onto the electronic device. A pressure adjustment mechanism communicates with at least one of the mold chases and applies an additional clamping pressure onto one or more portions of the mold chase. The pressure adjustment mechanism comprises movable supports that are displaceable in directions which are substantially perpendicular to the direction of the clamping force so as to transmit and apply the said additional clamping pressure onto the mold chase, and also a plurality of piezoelectric actuators which are operative to apply displacement forces to the movable supports in their displacement directions.