The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2011

Filed:

Feb. 18, 2009
Applicants:

Michael Su, Round Rock, TX (US);

Frank Kuechenmeister, Dresden, DE;

Jaime Bravo, Santiago, CL;

Inventors:

Michael Su, Round Rock, TX (US);

Frank Kuechenmeister, Dresden, DE;

Jaime Bravo, Santiago, CL;

Assignee:

Advanced Micro Devices, Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/58 (2006.01);
U.S. Cl.
CPC ...
Abstract

Various semiconductor chip reinforcement structures and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a semiconductor chip that has a side and forming a polymer layer on the side. The polymer layer has a central portion and a first frame portion spatially separated from the central portion to define a first channel. An underfill material may be provided to invade the channel and establish a mechanical joint between the polymer layer and the underfill material.


Find Patent Forward Citations

Loading…