The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2011
Filed:
Apr. 10, 2008
Kiyotaka Kizaki, Tokyo, JP;
Hiroshi Nakamura, Tokyo, JP;
Kiyotaka Kizaki, Tokyo, JP;
Hiroshi Nakamura, Tokyo, JP;
Disco Corporation, Tokyo, JP;
Abstract
A method of bonding an adhesive film for die bonding to the rear surface of a wafer having a plurality of devices on the front surface, comprising the steps of holding the front surface side of the wafer on the holding surface of a chuck table for holding the wafer; supplying the adhesive film onto the rear surface of the wafer held on the chuck table; and rolling a pressing-roller while pressing it against the adhesive film supplied onto the rear surface of the wafer to bond the adhesive film to the rear surface of the wafer, wherein the step of rolling the pressing-roller is carried out in such a positional relation that a straight line connecting the center of the wafer and a notch becomes parallel to the axis of the pressing-roller.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile