The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2011
Filed:
Nov. 30, 2006
Applicants:
Yi-wei Chen, Taichung County, TW;
Chao-ching Hsieh, Hsinchu Hsien, TW;
Tsai-fu Hsiao, Hsinchu, TW;
Yu-lan Chang, Kaohsiung, TW;
Tsung-yu Hung, Tainan County, TW;
Chun-chieh Chang, Tainan County, TW;
Inventors:
Yi-Wei Chen, Taichung County, TW;
Chao-Ching Hsieh, Hsinchu Hsien, TW;
Tsai-Fu Hsiao, Hsinchu, TW;
Yu-Lan Chang, Kaohsiung, TW;
Tsung-Yu Hung, Tainan County, TW;
Chun-Chieh Chang, Tainan County, TW;
Assignee:
United Microelectronics Corp., Hsinchu, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/31 (2006.01); H01L 21/22 (2006.01); H01L 21/42 (2006.01); H01L 21/331 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor process is provided. The semiconductor process includes providing a substrate. Then, a surface treatment is performed to the substrate to form a buffer layer on the substrate. Next, a first pre-amorphous implantation is performed to the substrate.