The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 22, 2011

Filed:

Feb. 09, 2007
Applicants:

Genji Nakamura, Nirasaki, JP;

Yasushi Akasaka, Nirasaki, JP;

Inventors:

Genji Nakamura, Nirasaki, JP;

Yasushi Akasaka, Nirasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8238 (2006.01);
U.S. Cl.
CPC ...
Abstract

In a method for manufacturing a semiconductor device, an insulating film is formed on an entire surface of a substrate having a device isolation region and a first and a second conductive region. Then, a semiconductor device structure having a gate electrode forming region is formed on each of the conductive regions, the insulating film being disposed between the gate electrode forming region and each of the conductive regions. A gate electrode groove is formed in the gate electrode forming region of the semiconductor device structure, the insulating film being removed in the gate electrode groove. Thereafter, a gate insulating film and a film of metal gate electrode material are deposited on a bottom surface and a side surface of the gate electrode groove and an alloy is formed by alloying the film of metal gate electrode material deposited in a gate electrode groove of the first conductive region.


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