The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2011
Filed:
May. 30, 2008
George Kostiew, Chandler, AZ (US);
Raj Bahadur, Gilbert, AZ (US);
James Mellody, Phoenix, AZ (US);
George Vakanas, Tempe, AZ (US);
Leonel Arana, Phoenix, AZ (US);
George Kostiew, Chandler, AZ (US);
Raj Bahadur, Gilbert, AZ (US);
James Mellody, Phoenix, AZ (US);
George Vakanas, Tempe, AZ (US);
Leonel Arana, Phoenix, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
In one or more embodiments, a method comprising applying thermo compression to a package assembly including a lid, a die, and a package substrate to assemble the package assembly is disclosed. The method may include assembling the package assembly without coupling a biasing mechanism to the lid. Heat may be applied to a bond head coupled with a pick and place tool. Heat may be applied to a bond stage coupled to a carrier for holding the package assembly during processing. An adhesive applied to the lid or package substrate may be allowed to at least partially cure. The method may further include, in an oven, reflowing a thermal interface material (TIM) coupled to the lid and the die, curing the TIM, and/or curing the adhesive, without using clips.