The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2011
Filed:
Sep. 23, 2008
Applicant:
Robert R Atkinson, Jr., Chandler, AZ (US);
Inventor:
Robert R Atkinson, Jr., Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/053 (2006.01);
U.S. Cl.
CPC ...
Abstract
Embodiments of the present invention describe a bare die package and its methods of fabrication. The bare die package comprises a die electrically coupled to a package substrate, and a displacement constraint. In an embodiment of the present invention, the displacement constraint is a plurality of members fixedly attached onto the package substrate and surrounds the die. When the bare die package is secured between a socket and a heat sink, the plurality of members provide structural support to the package substrate and prevent excessive substrate warpage.