The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2011
Filed:
Dec. 12, 2006
Applicants:
Kuan Fu Chen, Taipei, TW;
Yin Jen Chen, Taipei, TW;
Tzung Ting Han, Yilan, TW;
Ming-shang Chen, Hsinchu, TW;
Shih Chin Lee, Yunlin, TW;
Inventors:
Kuan Fu Chen, Taipei, TW;
Yin Jen Chen, Taipei, TW;
Tzung Ting Han, Yilan, TW;
Ming-Shang Chen, Hsinchu, TW;
Shih Chin Lee, Yunlin, TW;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/318 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor fabrication process allows the fabrication of both logic and memory devices using a conventional CMOS process with a few additional steps. The additional steps, however, do not require additional masks. Accordingly, the process can be reduce the complexity, time, and cost for fabricating logic and memory devices on the same substrate, especially for embedded applications.