The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2011
Filed:
Aug. 05, 2008
Yutaka Kagaya, Tokyo, JP;
Fumitomo Watanabe, Tokyo, JP;
Yutaka Kagaya, Tokyo, JP;
Fumitomo Watanabe, Tokyo, JP;
Elpida Memory, Inc., Tokyo, JP;
Abstract
The semiconductor device is made up of two wiring boards, a semiconductor chip, and a sealing part. The two wiring boards are spaced apart, and a semiconductor chip is mounted so as to span the two wiring boards. The semiconductor chip includes a predetermined circuit and a plurality of electrode pads on one side thereof. The wiring board includes a plurality of connection pads on a semiconductor chip-mounting face, and a plurality of lands on the opposite side thereof. The land is electrically connected to a corresponding connection pad. An external terminal is formed on each of the lands. Further, the electrode pad formed in the semiconductor chip is electrically connected to the corresponding connection pad of the wiring board. Moreover, the semiconductor chip, the semiconductor chip mounting face of the wiring board, and the side faces of the wiring board are covered with the sealing part.